Provides semiconductor wafer lithography (product ultra-clean vacuum aluminum foil packaging)

Our unit can provide semiconductor lithographic process processing

Photolithography

1. Mask Size: 4 "X4"
2. Substrate: 2 ", 3", 4 "Focal wafer or decay film
3. Exposure area: 2 ", 3", 4 "

4. Mercury light source: 350W, 350 nm-450nm
5. Microscope: 10x10, 20x10 times
6. Exposure mode: Contact
7. Alignment system: All manual frontal alignment, infrared light and CCD opposition
8. Resolution: 1μm
9. Positive Alignment Accuracy: 0.2μm